Microelectronics Packaging

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1.Definition & Packaging

2.Topics of Packaging
2.1 Packaging Hierarchy and Design
2.2 Thermal Management - Heat Transfer
2.3 Packaging Materials

3.Chip-to-Package Interconnections
3.1 TAB (Tape Automated Bonding)
3.2 Wirebonding
3.3 Flip-Chip-Technology
3.4 Adhesive Technology

4.Packaging
4.1 Ceramic
4.2 Plastic
4.3 Thin-Film
4.4 Sealing and Encapsulation

5.Package to board interconnections
5.1 Through Hole Mounting (THM)
5.2 Surface Mounting Technology (SMT)

6.Package Reliability

7.Product Packaging

‹bersicht